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FAN3121TMX_F085 Fiches technique(PDF) 2 Page - Fairchild Semiconductor |
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FAN3121TMX_F085 Fiches technique(HTML) 2 Page - Fairchild Semiconductor |
2 / 20 page © 2012 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN3121 / FAN3122_F085 • Rev. 1.0.0 2 Ordering Information Part Number Logic Input Threshold Package Eco Status Packing Method Quantity per Reel FAN3121CMX_F085 Inverting Channels + Enable CMOS SOIC-8 RoHS Tape & Reel 2,500 FAN3121TMX_F085 TTL SOIC-8 RoHS Tape & Reel 2,500 FAN3122CMX_F085 Non-Inverting Channels + Enable CMOS SOIC-8 RoHS Tape & Reel 2,500 FAN3122TMX_F085 TTL SOIC-8 RoHS Tape & Reel 2,500 For Fairchild’s definition of “green” Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html. Package Outline Figure 3. SOIC-8 (Top View) Thermal Characteristics (1) Package JL (2) JT (3) JA (4) JB (5) JT (6) Units 8-Pin Small Outline Integrated Circuit (SOIC) 38 29 87 41 2.3 °C/W Notes: 1. Estimates derived from thermal simulation; actual values depend on the application. 2. Theta_JL ( JL): Thermal resistance between the semiconductor junction and the bottom surface of all the leads (including any thermal pad) that are typically soldered to a PCB. 3. Theta_JT ( JT): Thermal resistance between the semiconductor junction and the top surface of the package, assuming it is held at a uniform temperature by a top-side heatsink. 4. Theta_JA ( ΘJA): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking, and airflow. The value given is for natural convection with no heatsink, as specified in JEDEC standards JESD51-2, JESD51-5, and JESD51-7, as appropriate. 5. Psi_JB ( JB): Thermal characterization parameter providing correlation between semiconductor junction temperature and an application circuit board reference point for the thermal environment defined in Note 4. For the SOIC-8 package, the board reference is defined as the PCB copper adjacent to pin 6. 6. Psi_JT ( JT): Thermal characterization parameter providing correlation between the semiconductor junction temperature and the center of the top of the package for the thermal environment defined in Note 4. |
Numéro de pièce similaire - FAN3121TMX_F085_12 |
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Description similaire - FAN3121TMX_F085_12 |
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