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TCV7107F Fiches technique(PDF) 8 Page - Toshiba Semiconductor |
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TCV7107F Fiches technique(HTML) 8 Page - Toshiba Semiconductor |
8 / 17 page TCV7107F 2011-11-05 8 Thermal Shutdown (TSD) The TCV7107F provides thermal shutdown. When the junction temperature continues to rise and reaches TSD = 150°C (typ.), the TCV7107F goes into thermal shutdown and shuts off the power supply. TSD has a hysteresis of about 15°C (typ.). The device is enabled again when the junction temperature has dropped by approximately 15°C from the TSD trip point. The device resumes the power supply when the soft-start circuit is activated upon recovery from TSD state. Thermal shutdown is intended to protect the device against abnormal system conditions. It should be ensured that the TSD circuit will not be activated during normal operation of the system. Figure 5 Thermal Shutdown Operation Usage Precautions The input voltage, output voltage, output current and temperature conditions should be considered when selecting capacitors, inductors and resistors. These components should be evaluated on an actual system prototype for best selection. Parts of this product in the surrounding are examples of the representative, and the supply might become impossible. Please confirm latest information when using it. External components such as capacitors, inductors and resistors should be placed as close to the TCV7107F as possible. The TCV7107F has an ESD diode between the EN and VIN2 pins. The voltage between these pins should satisfy VEN − VIN2 0.3V. CIN should be connected as close to the PGND and VIN1 pins as possible. Operation might become unstable due to board layout. In that case, add a decoupling capacitor (CC) of 0.1 μF to 1μF between the SGND and VIN2 pins. The minimum programmable output voltage is 0.8V (typ.). If the difference between the input and output voltages is small, the output voltage might not be regulated accurately and fluctuate significantly. When TCV7107F is in operation, a negative voltage is generated since regeneration current flows through the switch pin (LX). Even if the current flows through the low side parasitic diode during the dead time of switching transistor, operation is undisturbed so an external flywheel diode is unnecessary. If there is the possibility of an external negative voltage generation, add a diode for protection. While non-synchronous mode is applied, connect external SBD as a low side element. SGND pin is connected with the back of IC chip and serves as the heat radiation pin. Secure the area of a GND pattern as large as possible for greater of heat radiation. The overcurrent protection circuits in the Product are designed to temporarily protect Product from minor overcurrent of brief duration. When the overcurrent protective function in the Product activates, immediately cease application of overcurrent to Product. Improper usage of Product, such as application of current to Product exceeding the absolute maximum ratings, could cause the overcurrent protection circuit not to operate properly and/or damage Product permanently even before the protection circuit starts to operate. The thermal shutdown circuits in the Product are designed to temporarily protect Product from minor overheating of brief duration. When the overheating protective function in the Product activates, immediately correct the overheating situation. Improper usage of Product, such as the application of heat to Product exceeding the absolute maximum ratings, could cause the overheating protection circuit not to operate properly and/or damage Product permanently even before the protection circuit starts to operate. Soft start TSD detection temperature: TSD GND Switching operation stops Recovery from TSD Switching operation starts VOUT 0 Tj Hysteresis: TSD |
Numéro de pièce similaire - TCV7107F |
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Description similaire - TCV7107F |
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