SN65HVD09-EP

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SLLSEA3

– DECEMBER 2011

ABSOLUTE MAXIMUM RATINGS

(1)

VALUE

UNIT

–0.3 to 6

V

Bus voltage range

–10 to 15

V

Data I/O and control (A side) voltage range

V

Receiver output current

±40

mA

B side and GND, ESD HBM

12

kV

B side and GND, ESD MM

400

V

Electrostatic discharge

All terminals, ESD HBM

4

kV

All terminals, ESD MM

400

V

Internally Limited

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.r

(2)

All voltage values are with respect to the GND terminals.

(3)

The maximum operating junction temperature is internally limited. Use the Dissipation Rating Table to operate below this temperature.

DISSIPATION RATINGS

PACKAGE

TA

≤ 25°C

POWER RATING

POWER RATING

DGG

2500 mW

20 mW/

°C

1600 mW

1300 mW

(1)

This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.

PACKAGE THERMAL CHARACTERISTICS

MIN

NOM

MAX

UNIT

Junction-to-ambient thermal

DGG, board-mounted, no air flow

50

°C/W

resistance

Junction-to-case thermal resistance

DGG

27

°C/W

Thermal shutdown temperature

165

°C

RECOMMENDED OPERATING CONDITIONS

MIN

NOM

MAX

UNIT

Supply voltage

4.75

5

5.25

V

High-level input voltage

2

V

Except nB+, nB

Low-level input voltage

0.8

V

Voltage at any bus terminal (separately or common-mode)

nB+ or nB

–

–7

12

V

Driver

–60

60

mA

Output current

Receiver

–8

8

mA

Operating free-air temperature

–40

85

°C

(1)

n = 1 - 9

Copyright

© 2011, Texas Instruments Incorporated

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