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TPS9111IPW Fiches technique(PDF) 3 Page - Texas Instruments |
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TPS9111IPW Fiches technique(HTML) 3 Page - Texas Instruments |
3 / 23 page TPS9111 CELLULAR SUBSCRIBER TERMINAL POWER SUPPLY SLVS134A – NOVEMBER 1996 – REVISED APRIL 1998 3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TPS9111Y chip information These chips, when properly assembled, display characteristics similar to those of the TPS9111. Thermal compression or ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be mounted with conductive epoxy or a gold-silicon preform. CHIP THICKNESS: 15 TYPICAL BONDING PADS: 3.3 × 3.3 MINIMUM TJ max = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. 153 94 4 12 25 26 56 7 89 10 11 13 14 15 16 17 24 23 22 21 20 19 18 27 28 1 2 3 BONDING PAD ASSIGNMENTS |
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