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TPS9110IPWLE Fiches technique(PDF) 3 Page - Texas Instruments |
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TPS9110IPWLE Fiches technique(HTML) 3 Page - Texas Instruments |
3 / 23 page TPS9110 CELLULAR SUBSCRIBER TERMINAL POWER SUPPLY SLVS164 – AUGUST 1997 3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TPS9110Y chip information These chips, when properly assembled, display characteristics similar to those of the TPS9110. Thermal compression or ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be mounted with conductive epoxy or a gold-silicon preform. CHIP THICKNESS: 15 TYPICAL BONDING PADS: 3.3 × 3.3 MINIMUM TJ max = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. 153 94 4 12 25 26 56 7 89 10 11 13 14 15 16 17 24 23 22 21 20 19 18 27 28 1 2 3 BONDING PAD ASSIGNMENTS |
Numéro de pièce similaire - TPS9110IPWLE |
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Description similaire - TPS9110IPWLE |
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