TPS79901-Q1, TPS79912-Q1, TPS79915-Q1

TPS79918-Q1, TPS79925-Q1, TPS79927-Q1, TPS79933-Q1

SBVS097E

– MARCH 2008 – REVISED JANUARY 2012

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ABSOLUTE MAXIMUM RATINGS

(1)

over operating temperature range (unless otherwise noted)

–0.3 V to 7 V

Peak output current

Internally limited

Continuous total power dissipation

See the Thermal Information table

–55°C to 150°C

–55°C to 150°C

ESD rating, HBM

2000 V

ESD rating, CDM

1000 V

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

THERMAL INFORMATION

TPS799xxQ1

UNITS

DRV (6 PINS)

DDC (5 PINS)

Junction-to-ambient thermal resistance

74.2

178.1

Junction-to-case (top) thermal resistance

58.8

70.7

Junction-to-board thermal resistance

145.9

73.4

°C/W

Junction-to-top characterization parameter

0.2

2.5

Junction-to-board characterization parameter

54.4

74.1

Junction-to-case (bottom) thermal resistance

7.2

n/a

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.

2

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Copyright

© 2008–2012, Texas Instruments Incorporated

Product Folder Link(s): TPS79901-Q1 TPS79912-Q1 TPS79915-Q1 TPS79918-Q1 TPS79925-Q1 TPS79927-Q1

TPS79933-Q1