TPS7510x

SBVS080H – SEPTEMBER 2006 – REVISED JANUARY 2010

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PRODUCT ID

TPS7510x yyyz

X is the nominal default diode output current (for example, 3 = 3mA, 5 = 5mA, and 0 = 10mA).

YYY is the package designator.

Z is the reel quantity (R = 3000, T = 250).

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Default set currents from 3mA to 10mA in 1mA increments are available through the use of innovative factory EEPROM programming.

Minimum order quantities may apply. Contact factory for details and availability.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating temperature range (unless otherwise noted).

PARAMETER

VALUE

–0.3V to +7.0V

35mA

D1A, D2A, D1B, D2B short circuit duration

Indefinite

Continuous total power dissipation

Internally limited

–55°C to +150°C

Storage temperature

–55°C to +150°C

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

DISSIPATION RATINGS

DERATING FACTOR

ABOVE

BOARD

PACKAGE

YFF

55°C/W

208°C/W

4.8mW/°C

480mW

264mW

192mW

YFF

55°C/W

142°C/W

7.0mW/°C

704mW

387mW

282mW

DSK

40°C/W

60.6°C/W

17mW/°C

1650mW

908mW

660mW

(1)

The JEDEC low-K (1s) board used to derive this data was a 3 inch × 3 inch, two-layer board with 2 ounce copper traces on top of the

board.

(2)

The JEDEC high-K (2s2p) board used to derive this data was a 3 inch × 3 inch, multi-layer board with 1 ounce internal power and

ground planes and 2 ounce copper traces on top and bottom of the board.

RECOMMENDED OPERATING CONDITIONS

PARAMETER

MIN

TYP

MAX

UNIT

2.7

5.5

V

3

25

mA

33

ms

–40

+85

°C

2

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