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TPS5430-EP Fiches technique(PDF) 3 Page - Texas Instruments |
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TPS5430-EP Fiches technique(HTML) 3 Page - Texas Instruments |
3 / 28 page DISSIPATION RATINGS (1) (2) RECOMMENDED OPERATING CONDITIONS TPS5430-EP www.ti.com................................................................................................................................................................................................... SLVS911 – MARCH 2009 THERMAL IMPEDANCE PACKAGE JUNCTION-TO-AMBIENT 8-pin DDA (2-layer board with solder)(3) 33°C/W 8-pin DDA (4-layer board with solder)(4) 26°C/W (1) Maximum power dissipation may be limited by overcurrent protection. (2) Power rating at a specific ambient temperature TA should be determined with a junction temperature of 125°C. This is the point where distortion starts to substantially increase. Thermal management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance and long-term reliability. See Thermal Calculations in applications section of this data sheet for more information. (3) Test board conditions: a. 3 in × 3 in, two layers, thickness: 0.062 in b. 2-oz copper traces located on the top and bottom of the PCB c. Six thermal vias in the thermal pad area under the device package (4) Test board conditions: a. 3 in × 3 in, four layers, thickness: 0.062 in b. 2-oz copper traces located on the top and bottom of the PCB c. 2-oz copper ground planes on the two internal layers d. Six thermal vias in the thermal pad area under the device package MIN MAX UNIT VIN Input voltage 5.5 36 V TJ Operating junction temperature –55 125 °C Copyright © 2009, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s): TPS5430-EP |
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