DISSIPATION RATINGS

(1) (2)

RECOMMENDED OPERATING CONDITIONS

TPS5430-EP

THERMAL IMPEDANCE

PACKAGE

JUNCTION-TO-AMBIENT

33°C/W

26°C/W

(1)

Maximum power dissipation may be limited by overcurrent protection.

(2)

distortion starts to substantially increase. Thermal management of the final PCB should strive to keep the junction temperature at or

below 125°C for best performance and long-term reliability. See Thermal Calculations in applications section of this data sheet for more

information.

(3)

Test board conditions:

a. 3 in × 3 in, two layers, thickness: 0.062 in

b. 2-oz copper traces located on the top and bottom of the PCB

c. Six thermal vias in the thermal pad area under the device package

(4)

Test board conditions:

a. 3 in × 3 in, four layers, thickness: 0.062 in

b. 2-oz copper traces located on the top and bottom of the PCB

c. 2-oz copper ground planes on the two internal layers

d. Six thermal vias in the thermal pad area under the device package

MIN

MAX

UNIT

VIN

Input voltage

5.5

36

V

Operating junction temperature

–55

125

°C

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