Save Space and Manage Thermal Issues

in Mobile Designs

Designers of mobile devices are challenged to save space, increase efficiency

and manage thermal issues in their end applications. Now minimizing both board

space and R

FETs. These advanced WLCSP MOSFETs use a state-of-the-art “fine pitch,”

thin WLCSP packaging process which enables the devices to combine excel-

lent thermal transfer characteristics, ultra-low profile (<0.4mm) and small

(0.8mm x 0.8mm) packaging, low gate charge, and low R

Advantages

PCBarea

• Ultra-thinpackage:lessthan

0.4mmheightwhenmounted

toPCB

• Excellentthermal

characteristics

• HBMESDprotectionlevel

2kV(FDZ661PZ)

Applications

• Batterymanagement

• Loadswitch

• Batteryprotection

For more information, please visit:

fairchildsemi.com/pf/FD/FDZ661PZ.html

fairchildsemi.com/pf/FD/FDZ663P.html

State-of-the-Art Fine Pitch,Thin WLCSP for Mobile Devices

Product

Number

BV

DSS

(V)

V

GS

(V)

V

R

DS(ON)

(mΩ)

Max

Q

(nC) @

V

4.5V

i

D

(A)

P

D

(W)

Package

FDZ661PZ

-20

±8

-1.5V

GS

- 4.5V

GS

6.3

8.8

-2.6

0.4

WlCSP

(0.8mm x 0.8mm)

315mΩ

140mΩ

FDZ663P

-20

±8

-1.5V

GS

- 4.5V

GS

5.9

8.2

-2.7

0.4

WlCSP

(0.8mm x 0.8mm)

288mΩ

134mΩ