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TPS82670SIP Fiches technique(PDF) 3 Page - Texas Instruments |
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TPS82670SIP Fiches technique(HTML) 3 Page - Texas Instruments |
3 / 27 page TPS82670, TPS82671, TPS82672, TPS82673 TPS82674, TPS82675, TPS82676, TPS82677, TPS826711 www.ti.com SLVSAI0D – OCTOBER 2010 – REVISED APRIL 2012 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) VALUE UNIT MIN MAX Voltage at VIN(2)(3) –0.3 6 V VI Voltage at VOUT(3) –0.3 3.6 V Voltage at EN, MODE (3) –0.3 VIN + 0.3 V Power dissipation Internally limited TA Operating temperature range(4) –40 85 °C TINT (max) Maximum internal operating temperature 125 °C Tstg Storage temperature range –55 125 °C Human body model 2 kV ESD rating (5) Charge device model 1 kV Machine model 200 V (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Operation above 4.8V input voltage for extended periods may affect device reliability. (3) All voltage values are with respect to network ground terminal. (4) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating temperature (TINT(max)), the maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package in the application ( θJA), as given by the following equation: TA(max)= TJ(max)–(θJA X PD(max)). To achieve optimum performance, it is recommended to operate the device with a maximum internal temperature of 105°C. (5) The human body model is a 100-pF capacitor discharged through a 1.5-k Ω resistor into each pin. The machine model is a 200-pF capacitor discharged directly into each pin. THERMAL INFORMATION TPS8267xSIP THERMAL METRIC(1)(2) SIP UNITS 8 PINS θJA Junction-to-ambient (top) thermal resistance 125 Junction-to-ambient (bottom) thermal resistance 70 θJCtop Junction-to-case (top) thermal resistance θJB Junction-to-board thermal resistance °C/W ψJT Junction-to-top characterization parameter ψJB Junction-to-board characterization parameter θJCbot Junction-to-case (bottom) thermal resistance (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) Thermal data have been measured using TI's 4-layer evaluation board. RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT VIN Input voltage range 2.3 4.8(1) V IO Output current range TPS82671 to TPS826711 0 600 mA TPS82670 to TPS82676 0 2.5 µF TPS826711 Additional output capacitance (PFM/PWM operation)(2) TPS82677, TPS82678 0 4 µF Additional output capacitance (PWM operation)(2) 0 7 µF TA Ambient temperature –40 +85 °C TJ Operating junction temperature –40 +125 °C (1) Operation above 4.8V input voltage for extended periods may affect device reliability. (2) In certain applications larger capacitor values can be tolerable, see output capacitor selection section for more details. Copyright © 2010–2012, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s): TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 |
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