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TPS659106 Fiches technique(PDF) 1 Page - Texas Instruments |
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TPS659106 Fiches technique(HTML) 1 Page - Texas Instruments |
1 / 96 page TPS65910, TPS65910A, TPS65910A3, TPS659101, TPS659102, TPS659103 TPS659104, TPS659105, TPS659106, TPS659107, TPS659108, TPS659109 www.ti.com SWCS046N – MARCH 2010 – REVISED APRIL 2012 Integrated Power Management Unit Top Specification Check for Samples: TPS65910, TPS65910A, TPS65910A3, TPS659101, TPS659102, TPS659103, TPS659104, TPS659105, TPS659106, TPS659107, TPS659108, TPS659109 1 FEATURES APPLICATIONS The purpose of the TPS65910 device is to • Portable and handheld systems provide the following resources: • OMAP3 power management • Embedded power controller DESCRIPTION • Two efficient step-down dc-dc converters for The TPS65910 is an integrated power-management processor cores IC available in 48-QFN package and dedicated to • One efficient step-down dc-dc converter for I/O applications powered by one Li-Ion or Li-Ion polymer power battery cell or 3-series Ni-MH cells, or by a 5-V input; • One efficient step-up 5-V dc-dc converter it requires multiple power rails. The device provides three step-down converters, one step-up converter, • SmartReflex™ compliant dynamic voltage and eight LDOs and is designed to support the management for processor cores specific power requirements of OMAP-based • 8 LDO voltage regulators and one RTC LDO applications. (internal purpose) Two of the step-down converters provide power for • One high-speed I2C interface for general- dual processor cores and are controllable by a purpose control commands (CTL-I2C) dedicated class-3 SmartReflex interface for optimum • One high-speed I2C interface for SmartReflex power savings. The third converter provides power for Class 3 control and command (SR-I2C) the I/Os and memory in the system. • Two enable signals multiplexed with SR-I2C, The device includes eight general-purpose LDOs configurable to control any supply state and providing a wide range of voltage and current processor cores supply voltage capabilities; they are fully controllable by the I2C interface. The use of the LDOs is flexible; they are • Thermal shutdown protection and hot-die intended to be used as follows: Two LDOs are detection designated to power the PLL and video DAC supply • A real-time clock (RTC) resource with: rails on the OMAP based processors, four general- – Oscillator for 32.768-kHz crystal or 32-kHz purpose auxiliary LDOs are available to provide built-in RC oscillator power to other devices in the system, and two LDOs are provided to power DDR memory supplies in – Date, time and calendar applications requiring these memories. – Alarm capability In addition to the power resources, the device • One configurable GPIO contains an embedded power controller (EPC) to • DC-DC switching synchronization through manage the power sequencing requirements of the internal or external 3-MHz clock OMAP systems and an (RTC). Figure 1 shows the top-level diagram of the device. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Copyright © 2010–2012, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
Numéro de pièce similaire - TPS659106 |
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Description similaire - TPS659106 |
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