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ADP1046-100-EVALZ Fiches technique(PDF) 10 Page - Analog Devices

No de pièce ADP1046-100-EVALZ
Description  Digital Controller for Isolated
Download  96 Pages
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Fabricant  AD [Analog Devices]
Site Internet  http://www.analog.com
Logo AD - Analog Devices

ADP1046-100-EVALZ Fiches technique(HTML) 10 Page - Analog Devices

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ADP1046
Data Sheet
Rev. 0 | Page 10 of 96
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
Supply Voltage (Continuous), VDD
4.2 V
Digital Pins: OUTA, OUTB, OUTC, OUTD,
OUTAUX, SR1, SR2, GATE, PGOOD1,
PGOOD2
−0.3 V to VDD + 0.3 V
VS3− to PGND, AGND, DGND
−0.3 V to +0.3 V
VS1, VS2, VS3+
−0.3 V to VDD + 0.3 V
RTD, ADD
−0.3 V to VDD + 0.3 V
CS1, CS2+, CS2−
−0.3 V to VDD + 0.3 V
FLAGIN, PSON
−0.3 V to VDD + 0.3 V
SDA, SCL
−0.3 V to VDD + 0.3 V
SHAREo, SHAREi
−0.3 V to VDD + 0.3 V
Operating Temperature Range
−40°C to +125°C
Storage Temperature Range
−65°C to +150°C
Junction Temperature
150°C
Peak Solder Reflow Temperature
SnPb Assemblies (10 sec to 30 sec)
240°C
RoHS-Compliant Assemblies
(20 sec to 40 sec)
260°C
ESD Charged Device Model
1.5 kV
ESD Human Body Model
3.5 kV
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
θJA
θJC
Unit
32-Lead LFCSP
44.4
6.4
°C/W
SOLDERING
It is important to follow the correct guidelines when laying out
the PCB footprint for the ADP1046 and when soldering the
part onto the PCB. For detailed information about these guide-
lines, see the AN-772 Application Note.
ESD CAUTION


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