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ADR435 Fiches technique(PDF) 9 Page - Analog Devices

No de pièce ADR435
Description  Quad-Channel, 12-Bit, Serial Input, 4 mA to 20 mA Output
Download  44 Pages
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Fabricant  AD [Analog Devices]
Site Internet  http://www.analog.com
Logo AD - Analog Devices

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Data Sheet
AD5737
Rev. B | Page 9 of 44
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. Transient currents of up to
100 mA do not cause SCR latch-up.
Table 4.
Parameter
Rating
AVDD, VBOOST_x to AGND, DGND
−0.3 V to +33 V
AVCC to AGND
−0.3 V to +7 V
DVDD to DGND
−0.3 V to +7 V
Digital Inputs to DGND
−0.3 V to DVDD + 0.3 V or +7 V
(whichever is less)
Digital Outputs to DGND
−0.3 V to DVDD + 0.3 V or +7 V
(whichever is less)
REFIN, REFOUT to AGND
−0.3 V to AVDD + 0.3 V or +7 V
(whichever is less)
IOUT_x to AGND
AGND to VBOOST_x or 33 V if
using the dc-to-dc converter
SWx to AGND
−0.3 V to +33 V
AGND, GNDSWx to DGND
−0.3 V to +0.3 V
Operating Temperature Range (TA)
Industrial1
−40°C to +105°C
Storage Temperature Range
−65°C to +150°C
Junction Temperature (TJ max)
125°C
Power Dissipation
(TJ max − TA)/θJA
Lead Temperature
JEDEC industry standard
Soldering
J-STD-020
1
Power dissipated on chip must be derated to keep the junction temperature
below 125°C.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Junction-to-air thermal resistance (θJA) is specified for a JEDEC
4-layer test board.
Table 5. Thermal Resistance
Package Type
θJA
Unit
64-Lead LFCSP (CP-64-3)
20
°C/W
ESD CAUTION


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