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FAN3850TUC15X35 Fiches technique(PDF) 10 Page - Fairchild Semiconductor

No de pièce FAN3850TUC15X35
Description  Microphone Pre-Amplifier with Temperature Compensation and Digital Output
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Fabricant  FAIRCHILD [Fairchild Semiconductor]
Site Internet  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

FAN3850TUC15X35 Fiches technique(HTML) 10 Page - Fairchild Semiconductor

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© 2011 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN3850T • Rev. 3.0.0
10
Physical Dimensions
Figure 10. 6-Ball, Wafer-Level Chip-Scale Package (WLCSP)
Table 1.
Product-Specific Dimensions
D
E
X
Y
1.260mm
0.860mm
0.145mm
0.145mm
Ball Composition: SN97.5-Ag2.5
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
BOTTOM VIEW
TOP VIEW
1
2
A
B
C
6X
0.005
CA B
(X) +/-0.018
(Y) +/-0.018
Ø0.120±0.010
F
E
D
B
A
PIN A1
AREA
F
2X
2X
(Ø0.120)
CU PAD
SIDE VIEWS
0.06 C
D
C
SEATING
PLANE
0.03 C
0.03 C
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
D. DATUM C, THE SEATING PLANE IS DEFINED
BY THE SPHERICAL CROWNS OF THE BALLS.
E. PACKAGE TYPICAL HEIGHT IS 273 MICRONS
±23 MICRONS (254-300 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILENAME: UC006AHrev3.
E
0.080±0.010
0.570
0.485
0.197±0.013
0.300
0.254
0.570
0.485
RECOMMENDED LAND
PATTERN (NSMD)
(Ø0.220)
SOLDER MASK
A1
0.01 C


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