TPS7A3401DGNR datasheet(11/18 Pages) TI

No de pièce	TPS7A3401DGNR

Description	-20-V, -200-mA, Low-Noise NEGATIVE VOLTAGE REGULATOR

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Fabricant	TI [Texas Instruments]

Site Internet	http://www.ti.com

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P

=(V

V

)I

-

D

IN

OUT

TPS7A3401

www.ti.com

SBVS163

– JUNE 2011

LAYOUT

PACKAGE MOUNTING

complete design (including heatsink), increase the

ambient temperature until the thermal protection is

Solder

pad

footprint

recommendations

for

the

triggered; use worst-case loads and signal conditions.

TPS7A3401 are available at the end of this product

For good reliability, thermal protection should trigger

datasheet and at www.ti.com.

at least +35

°C above the maximum expected ambient

condition

of

your

particular

application.

This

BOARD LAYOUT RECOMMENDATIONS TO

configuration

produces

a

worst-case

junction

IMPROVE PSRR AND NOISE PERFORMANCE

temperature of +125

°C at the highest expected

ambient temperature and worst-case load.

To improve ac performance such as PSRR, output

noise, and transient response, it is recommended that

The internal protection circuitry of the TPS7A3401

the board be designed with separate ground planes

has been designed to protect against overload

for IN and OUT, with each ground plane connected

conditions. It was not intended to replace proper

only at the GND pin of the device. In addition, the

heatsinking. Continuously running the TPS7A3401

ground connection for the output capacitor should

into thermal shutdown degrades device reliability.

connect directly to the GND pin of the device.

POWER DISSIPATION

Equivalent series inductance (ESL) and equivalent

series resistance (ESR) must be minimized in order

The ability to remove heat from the die is different for

to maximize performance and ensure stability. Every

each

package

type,

presenting

different

capacitor (CIN, COUT, CBYP) must be placed as close

considerations in the PCB layout. The PCB area

as possible to the device and on the same side of the

around the device that is free of other components

printed circuit board (PCB) as the regulator itself.

moves the heat from the device to the ambient air.

Using heavier copper increases the effectiveness in

Do not place any of the capacitors on the opposite

removing heat from the device. The addition of plated

side of the PCB from where the regulator is installed.

through-holes to heat dissipating layers also improves

The

use

of

vias

and

long

traces

is

strongly

the heatsink effectiveness.

discouraged

because

they

may

impact

system

performance negatively and even cause instability.

Power dissipation depends on input voltage and load

conditions. Power dissipation (PD) is equal to the

If possible, and to ensure the maximum performance

product of the output current times the voltage drop

denoted in this product data sheet, use the same

across the output pass element, as shown in

layout pattern used for the TPS7A30 evaluation

Equation 2:

board, available at www.ti.com.

(2)

THERMAL PROTECTION

SUGGESTED LAYOUT AND SCHEMATIC

Thermal protection disables the output when the

junction temperature rises to approximately +170

°C,

Layout is a critical part of good power-supply design.

allowing the device to cool. When the junction

There

are

several

signal

paths

that

conduct

temperature cools to approximately +150

°C, the

fast-changing currents or voltages that can interact

output circuitry is enabled. Depending on power

with stray inductance or parasitic capacitance to

dissipation,

thermal

resistance,

and

ambient

generate

noise

or

degrade

the

power-supply

temperature, the thermal protection circuit may cycle

performance. To help eliminate these problems, the

on and off. This cycling limits the dissipation of the

IN pin should be bypassed to ground with a low ESR

regulator, protecting it from damage as a result of

ceramic bypass capacitor with an X5R or X7R

overheating.

dielectric.

Any tendency to activate the thermal protection circuit

The GND pin should be tied directly to the PowerPAD

indicates

excessive

power

dissipation

or

an

under the IC. The PowerPAD should be connected to

inadequate heatsink. For reliable operation, junction

any internal PCB ground planes using multiple vias

temperature should be limited to a maximum of

directly under the IC.

+125

°C. To estimate the margin of safety in a

Copyright

11

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