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BAS40-06 Fiches technique(PDF) 1 Page - Micro Commercial Components

No de pièce BAS40-06
Description  Surface Mount Schottky Barrier Diode 200 mWatt
Download  4 Pages
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Fabricant  MCC [Micro Commercial Components]
Site Internet  http://www.mccsemi.com
Logo MCC - Micro Commercial Components

BAS40-06 Fiches technique(HTML) 1 Page - Micro Commercial Components

  BAS40-06 Datasheet HTML 1Page - Micro Commercial Components BAS40-06 Datasheet HTML 2Page - Micro Commercial Components BAS40-06 Datasheet HTML 3Page - Micro Commercial Components BAS40-06 Datasheet HTML 4Page - Micro Commercial Components  
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Features
SOT-23 Package For surface mount application
Protects from line to VCC and line to ground
Low forward voltage and reverse recovery characteristics
Bidirectional-low-forward available with “ -04” suffix (Figure 2)
Tape & Reel EIA Standard 481.
Mechanical Data
Mounting Position: Any
Weight: .008 grams (approx.)
MAXIMUM RATINGS
Operating Temperature: -55
oC to +125oC
Storage Temperature: -55
oC to +150oC
Power Dissipation: 200 mWatts @ Tamb=25
oC
Forward Continuous Current:
Surge Forward Current: 600mA @ tp<1s, Tamb=25
oC
DESCRIPTION
Various configurations of Schottky barrier’ s diodes in SOT-23
package are provided for general-purpose use in high-speed
switching ,mixers and detector applications. They may also be
used for signal integrity and counteract the transmission-line
effects with (PC) board trances by clamping over/and undershoot
from signal reflections with the schottky-low-threshold voltages.
This type of termination also does not depend on matching
the transmission line characteristic impedance, making it
particularly useful where line impendance is unknown or a
variable. This methode of termination can control distortions of
clock, data, address, and control lines as well as provides a
stabilizing effect on signal jitter. It can also significantly reduce
power consumption compared to standard resistor-based
termination methods.
BAS40
THRU
BAS70
Surface Mount
Schottky Barrier Diode
200 mWatt
Suggested Solder
Pad Layout
DIMENSIONS
INCHES
MM
DIM
MIN
MAX
MIN
MAX
NOTE
A
.110
.120
2.80
3.04
B
.083
.098
2.10
2.64
C
.047
.055
1.20
1.40
D
.035
.041
.89
1.03
E
.070
.081
1.78
2.05
F
.018
.024
.45
.60
G
.0005
.0039
.013
.100
H
.035
.044
.89
1.12
J
.003
.007
.085
.180
K
.015
.020
.37
.51
.079
2.000
inches
mm
.031
.800
.035
.900
.037
.950
.037
.950
K
A
B
C
D
E
F
G
H
J
SOT-23
 omponents
20736 Marilla
Street Chatsworth

 !"#
$%    !"#
MCC
www.mccsemi.com
Revision:
A
20
11/01/01
TM
Micro Commercial Components
1 of 4
@
IFM
BAS40
=200mA
Ta =25
o
C
@
IFM
BAS70
=70mA
Ta =25
o
C
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1


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