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ISL23511UFB8Z Fiches technique(PDF) 9 Page - Intersil Corporation |
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ISL23511UFB8Z Fiches technique(HTML) 9 Page - Intersil Corporation |
9 / 10 page 9 FN6588.1 January 21, 2008 ISL23511 Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN) 6 B E A D 0.10 C 2X 2 0.10 M C A B 0.05 M C (ND-1) X e C 0.05 C A 0.10 C A1 SEATING PLANE e INDEX AREA PIN #1 ID 3 5 (DATUM A) (DATUM B) N-1 1 N NX L NX b 2 1 N TOP VIEW BOTTOM VIEW SIDE VIEW NX (b) SECTION "C-C" FOR ODD TERMINAL/SIDE e CC 5 C L TERMINAL TIP (A1) L DETAIL “A” PIN 1 ID L 0.05 MIN 0.10 MIN 0.10 C 2X 4xk b L10.2.1x1.6A 10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE SYMBOL MILLIMETERS NOTES MIN NOMINAL MAX A 0.45 0.50 0.55 - A1 - - 0.05 - A3 0.127 REF - b 0.15 0.20 0.25 5 D 2.05 2.10 2.15 - E 1.55 1.60 1.65 - e 0.50 BSC - k0.20 -- - L 0.35 0.40 0.45 - N10 2 Nd 4 3 Ne 1 3 θ 0- 12 4 Rev. 3 6/06 NOTES: 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. 2. N is the number of terminals. 3. Nd and Ne refer to the number of terminals on D and E side, respectively. 4. All dimensions are in millimeters. Angles are in degrees. 5. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 7. Maximum package warpage is 0.05mm. 8. Maximum allowable burrs is 0.076mm in all directions. 9. Same as JEDEC MO-255UABD except: No lead-pull-back, "A" MIN dimension = 0.45 not 0.50mm "L" MAX dimension = 0.45 not 0.42mm. 10. For additional information, to assist with the PCB Land Pattern Design effort, see Intersil Technical Brief TB389. 2.00 0.80 1.75 0.25 0.50 0.275 2.50 LAND PATTERN 10 |
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