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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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DAC3484IRKDT Fiches technique(PDF) 5 Page - Texas Instruments |
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DAC3484IRKDT Fiches technique(HTML) 5 Page - Texas Instruments |
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5 / 82 page  DAC3484 www.ti.com SLAS749A – MARCH 2011 – REVISED JULY 2011 PIN FUNCTIONS (continued) PIN I/O DESCRIPTION NAME NO. SCLK A31 I Serial interface clock. Internal pull-down. SDENB B28 I Active low serial data enable, always an input to the DAC3484. Internal pull-up. Serial interface data. Bi-directional in 3-pin mode (default) and uni-directional 4-pin mode. Internal SDIO A30 I/O pull-down. Uni-directional serial interface data in 4-pin mode. The SDO pin is tri-stated in 3-pin interface mode SDO B27 O (default). SLEEP B40 I Active high asynchronous hardware power-down input. Internal pull-down. Optional LVDS SYNC positive input. The SYNCP/N LVDS pair has an internal 100 Ω termination SYNCP A5 I resistor. If unused it can be left unconnected. SYNCN B5 I Optional LVDS SYNC negative input. Active low input for chip RESET, which resets all the programming registers to their default state. RESETB B30 I Internal pull-up. Transmit enable active high input. Internal pull-down. To enable analog output data transmission, set sif_txenable in register config3 to “1” or pull CMOS TXENABLE A32 I TXENABLE pin to high. To disable analog output, set sif_txenable to “0” and pull CMOS TXENABLE pin to low. The DAC output is forced to midscale. TESTMODE A44 I This pin is used for factory testing. Internal pull-down. Leave unconnected for normal operation. Digital supply voltage. This supply pin is also used for factory fuse programming. Connect to VFUSE B4 I DACVDD for normal operation. ORDERING INFORMATION(1) TA ORDER CODE PACKAGE DRAWING/TYPE(2)(3) TRANSPORT MEDIA QUANTITY DAC3484IRKDT 250 –40°C to 85°C RKD / 88 WQFN Quad Flatpack No-Lead Tape and Reel DAC3484IRKDR 2000 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com. (2) Thermal Pad Size: 6.4 mm x 6.4 mm (3) MSL Peak Temperature: Level-3-260C-168 HR Copyright © 2011, Texas Instruments Incorporated 5 |
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