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U0402FC08C Fiches technique(PDF) 1 Page - Protek Devices |
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U0402FC08C Fiches technique(HTML) 1 Page - Protek Devices |
1 / 8 page Only One Name Means ProTek’Tion™ www.protekdevices.com 05149.R6 2/11 Page 1 U0402FC3.3C - U0402FC36C 250w UnbUmPed FliP ChiP tvs aRRay desCRiPtion The U0402FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 requirements. These devices are ideally suited for handheld devices, PCMCIA and SMART cards. This series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 250 Watts per line for an 8/20µs waveform. In addition, the U0402FCxxC series features superior clamping performance, low leak- age current characteristics and a response time of less than a nanosecond. Their low inductance virtually eliminates overshoot voltage due to package inductance. FeatURes • Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV • Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns • ESD Protection > 25 kilovolts • Available in Voltages Ranging from 3.3V to 36V • 250 Watts Peak Pulse Power per Line (tp = 8/20µs) • Bidirectional Configuration and Monolithic Structure • Protection for 1 Line • RoHS Compliant • REACH Compliant meChaniCal ChaRaCteRistiCs • Standard EIA Chip Size: 0402 • Approximate Weight: 0.73 milligrams • Lead-Free Plating • Solder Reflow Temperature: • Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C • Flammability Rating UL 94V-0 • 8mm Plastic Tape per EIA Standard 481 aPPliCations • Cellular Phones • MCM Boards • Wireless Communication Circuits • IR LEDs • SMART & PCMCIA Cards U0402 PaCkage Pin ConFigURation |
Numéro de pièce similaire - U0402FC08C |
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Description similaire - U0402FC08C |
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