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LC0402FC36C Fiches technique(PDF) 6 Page - Protek Devices

No de pièce LC0402FC36C
Description  200W LOW CAPACITANCE flip chip tvs array
Download  9 Pages
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Fabricant  PROTEC [Protek Devices]
Site Internet  http://www.protekdevices.com
Logo PROTEC - Protek Devices

LC0402FC36C Fiches technique(HTML) 6 Page - Protek Devices

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Only One Name Means ProTek’Tion™
www.protekdevices.com
05139.R8 2/11
Page 6
LC0402FC3.3C - LC0402FC36C
sOLDER REFLOW INFORMATION
PRINTED CIRCuIT BOARD RECOMMENDATIONs
PARAMETER
vALuE
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask Defined Pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.150mm
Solder Stencil Aperture Opening (Laser cut, 5% tapered walls)
0.330mm Round
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance - Edge To Corner Ball
±50µm
Solder Ball Side Coplanarity
±20µm
Maximum Dwell Time Above Liquidous (183°C)
60 seconds
Soldering Maximum Temperature
270°C
T
P
30-60 seconds
Ramp-up
15 seconds
(Minimize)
solder-Time
15-20 seconds
Ramp-Down
Ramp-Down
solder Melt
(Maximum Temp)
Maximum solder Reflow
(35-53°C Above Maximum solder Melt Temp)
Ramp-up
Preheat
(stay Below Flux Activation Temp)
RECOMMENDED NON-sOLDER MAsK
DEFINED PAD ILLusTRATION
Non-solder Mask Defined Pad
0.275mm DIA.
solder Mask Opening
0.325mm DIA.
solder stencil Opening
0.330mm DIA.
REquIREMENTs
Temperature:
T
P for Lead-Free (Sn/Ag/Cu): 260-270°C
T
P for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux activa-
tion temperature, component size, weight, surface area and plating.


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