Moteur de recherche de fiches techniques de composants électroniques |
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IRFE024 Fiches technique(PDF) 2 Page - Seme LAB |
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IRFE024 Fiches technique(HTML) 2 Page - Seme LAB |
2 / 2 page IRFE024 02/00 Semelab plc. Telephone +44(0)1455 556565. Fax +44(0)1455 552612. E-mail: sales@semelab.co.uk Website: http://www.semelab.co.uk Parameter Test Conditions Min. Typ. Max. Unit 60 0.068 0.15 0.17 24 4.3 25 250 100 –100 640 340 69 9.0 26 2.0 5.0 6.0 13 14 70 37 45 6.7 27 2.3 200 1.9 Negligible 1.8 4.3 9.1 26 VGS = 0 ID = 1mA Reference to 25°C ID = 1mA VGS = 10V ID = 4.2A VGS = 10V ID = 6.7A VDS = VGS ID = 250mA VDS ³ 15V IDS = 4.2A VGS = 0 VDS = 0.8BVDSS TJ = 125°C VGS = 20V VGS = –20V VGS = 0 VDS = 25V f = 1MHz VGS = 10V ID = 6.7A VDS = 0.5BVDSS VDD = 30V ID = 6.7A RG = 7.5W IS = 6.7A TJ = 25°C VGS = 0 IF = 6.7A TJ = 25°C di / dt £ 100A/msVDD £ 50V ELECTRICAL CHARACTERISTICS (Tcase = 25°C unless otherwise stated) Drain – Source Breakdown Voltage Temperature Coefficient of Breakdown Voltage Static Drain – Source On–State Resistance 1 Gate Threshold Voltage Forward Transconductance 1 Zero Gate Voltage Drain Current Forward Gate – Source Leakage Reverse Gate – Source Leakage Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge Gate – Source Charge Gate – Drain (“Miller”) Charge Turn–On Delay Time Rise Time Turn–Off Delay Time Fall Time Continuous Source Current Pulse Source Current 2 Diode Forward Voltage 1 Reverse Recovery Time Reverse Recovery Charge 1 Forward Turn–On Time V V/°C W V S (É) mA nA pF nC ns A V ns mC nH °C/W BVDSS DBVDSS DTJ RDS(on) VGS(th) gfs IDSS IGSS IGSS Ciss Coss Crss Qg Qgs Qgd td(on) tr td(off) tf IS ISM VSD trr Qrr ton LD LS RqJC RqJPC STATIC ELECTRICAL RATINGS Notes 1) Pulse Test: Pulse Width £ 300ms, d£ 2% 2) Repetitive Rating – Pulse width limited by maximum junction temperature. DYNAMIC CHARACTERISTICS SOURCE – DRAIN DIODE CHARACTERISTICS Internal Drain Inductance (measured from 6mm down drain lead to centre of die) Internal Source Inductance (from 6mm down source lead to source bond pad) Thermal Resistance Junction – Case Thermal Resistance Junction – PC Board PACKAGE CHARACTERISTICS THERMAL CHARACTERISTICS |
Numéro de pièce similaire - IRFE024 |
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Description similaire - IRFE024 |
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