© 2009 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FAN3216 / FAN3217 • Rev. 1.0.1

2

Package Outlines

Figure 2. SOIC-8 (Top View)

Thermal Characteristics

(1)

Package



JL

(2)



JT

(3)



JA

(4)



JB

(5)



JT

(6)

Units

8-Pin Small Outline Integrated Circuit (SOIC)

40

31

89

43

3.0

°C/W

Notes:

1.

Estimates derived from thermal simulation; actual values depend on the application.

2.

Theta_JL (



thermal pad) that are typically soldered to a PCB.

3.

Theta_JT (



held at a uniform temperature by a top-side heatsink.

4.

The value given is for natural convection with no heatsink using a 2S2P board, as specified in JEDEC standards JESD51-2,

JESD51-5, and JESD51-7, as appropriate.

5.

Psi_JB (



application circuit board reference point for the thermal environment defined in Note 4. For the SOIC-8 package, the board

reference is defined as the PCB copper adjacent to pin 6.

6.

Psi_JT (



the center of the top of the package for the thermal environment defined in Note 4.