© 2009 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FAN5362 • Rev. 1.0.1

3

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable

above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition,

extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute

maximum ratings are stress ratings only.

Symbol

Parameter

Min.

Max.

Unit

Input Voltage

–0.3

6.5

V

Voltage on SW Pin

–0.3

(3)

V

EN and MODE Pin Voltage

–0.3

(3)

V

FB Pin

–0.3

4

V

ESD

Electrostatic Discharge

Protection Level

Human Body Model per JESD22-A114

3.0

kV

Charged Device Model per JESD22-C101

1.5

Junction Temperature

–40

+150

°C

Storage Temperature

–65

+150

°C

Lead Soldering Temperature, 10 Seconds

+260

°C

Note:

3.

Recommended Operating Conditions

The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating

conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend

exceeding them or designing to Absolute Maximum Ratings.

Symbol

Parameter

Min.

Typ.

Max.

Unit

Supply Voltage Range

2.7

(4)

5.5

V

Output Current for 2.1V

0

750

mA

Output Current for 2.5V, 2.7V, 2.9V, 3.3V

0

500

L

Inductor

1

µH

Input Capacitor

2.2

µF

Output Capacitor

10

24

µF

Operating Ambient Temperature

–40

+85

°C

Operating Junction Temperature

–40

+125

°C

Note:

4.

Thermal Properties

Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer

1s2p boards in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction temperature

Symbol

Parameter

Typical

Unit

Junction-to-Ambient Thermal Resistance

WLSCP

150

°C/W

UMLP

49