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FAN3226C Fiches technique(PDF) 2 Page - Fairchild Semiconductor

No de pièce FAN3226C
Description  Single 2A High-Speed, Low-Side Gate Driver
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Fabricant  FAIRCHILD [Fairchild Semiconductor]
Site Internet  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

FAN3226C Fiches technique(HTML) 2 Page - Fairchild Semiconductor

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© 2007 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN3100 • Rev. 1.0.3
2
Ordering Information
Part Number
Input
Threshold
Package
Packing Method
Quantity / Reel
FAN3100CMPX
CMOS
6-Lead 2x2mm MLP
Tape & Reel
3000
FAN3100CSX
CMOS
5-Pin SOT23
Tape & Reel
3000
FAN3100TMPX
TTL
6-Lead 2x2mm MLP
Tape & Reel
3000
FAN3100TSX
TTL
5-Pin SOT23
Tape & Reel
3000
Package Outlines
Figure 3. 2x2mm 6-Lead MLP (Top View)
Figure 4. SOT23-5 (Top View)
Thermal Characteristics(1)
Package
JL
(2)
JT
(3)
JA
(4)
JB
(5)
JT
(6)
Units
6-Lead 2x2mm Molded Leadless Package (MLP)
2.7
133
58
2.8
42
°C/W
SOT23-5
56
99
157
51
5
°C/W
Notes:
1.
Estimates derived from thermal simulation; actual values depend on the application.
2.
Theta_JL (
JL): Thermal resistance between the semiconductor junction and the bottom surface of all the leads (including any
thermal pad) that are typically soldered to a PCB.
3.
Theta_JT (
JT): Thermal resistance between the semiconductor junction and the top surface of the package, assuming it is
held at a uniform temperature by a top-side heatsink.
4.
Theta_JA (ΘJA): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking, and airflow.
The value given is for natural convection with no heatsink using a 2SP2 board, as specified in JEDEC standards JESD51-2,
JESD51-5, and JESD51-7, as appropriate.
5.
Psi_JB (
JB): Thermal characterization parameter providing correlation between semiconductor junction temperature and an
application circuit board reference point for the thermal environment defined in Note 4. For the MLP-6 package, the board
reference is defined as the PCB copper connected to the thermal pad and protruding from either end of the package. For the
SOT23-5 package, the board reference is defined as the PCB copper adjacent to pin 2.
6.
Psi_JT (
JT): Thermal characterization parameter providing correlation between the semiconductor junction temperature and
the center of the top of the package for the thermal environment defined in Note 4.


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