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LC866016 Fiches technique(PDF) 6 Page - Sanyo Semicon Device |
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LC866016 Fiches technique(HTML) 6 Page - Sanyo Semicon Device |
6 / 22 page LC86P6032 No.4212-6/22 Pin Assignment Package Dimension (unit : mm) 3159 SANYO : QIP-64E Notes • The QFP packages should be heat-soaked for 24 hours at 125 °C immediately prior to mounting (This baking is called pre-baking). • After pre-baking, a controlled environment must be maintained until soldering. The environment must be held at a temperature of 30 °C or less and a humidity level of 70% or less. Please solder within 8 hours. S29 S28 S27 S26 S25 S24 S23 S22 S21 S20 S19 S18 S17 S16 VP VDDVPP TEST1 RES XT1 XT2 VSS CF1 CF2 VDD P80/AN0 P81/AN1 P82/AN2 P83/AN3 P70/INT0 P71/INT1 72/INT2/T0IN 73/INT3/T0IN 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 |
Numéro de pièce similaire - LC866016 |
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Description similaire - LC866016 |
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