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BTA08-600TWRG Fiches technique(PDF) 5 Page - STMicroelectronics |
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BTA08-600TWRG Fiches technique(HTML) 5 Page - STMicroelectronics |
5 / 12 page BTA08, BTB08 and T8 Series Characteristics Doc ID 7472 Rev 7 5/12 Figure 7. Non-repetitive surge peak on-state current for a sinusoidal Figure 8. Relative variation of gate trigger current 0.01 0.10 1.00 10.00 10 100 1000 I (A), I t (A s) TSM 22 t (ms) p T initial=25°C j ITSM dI/dt limitation: 50A/µs I t 2 pulse with width t < 10 ms and corresponding value of I t p 2 360° α -40 -20 0 20 40 60 80 100 120 140 0.0 0.5 1.0 1.5 2.0 2.5 T (°C) j I,I ,I [T ] / GTHL j I ,I ,I [T =25°C] GTHL j IGT IH & IL holding current and latching current versus junction temperature (typical values) Figure 9. Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values) Figure 10. Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values) 0.1 1.0 10.0 100.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 (dV/dt)c (V/µs) (dI/dt)c [(dV/dt)c] / Specified (dI/dt)c TW T835/CW/BW T810/SW Snubberless and Logic level types 0.1 1.0 10.0 100.0 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 (dV/dt)c (V/µs) (dI/dt)c [(dV/dt)c] / Specified (dI/dt)c C B Standard types Figure 11. Relative variation of critical rate of decrease of main current versus junction temperature Figure 12. DPAK and D2PAK thermal resistance junction to ambient versus copper surface under tab 0 25 50 75 100 125 0 1 2 3 4 5 6 (dI/dt)c [T ] / pecified] j (dI/dt)c [T s j T (°C) j 0 4 8 1216202428323640 0 10 20 30 40 50 60 70 80 90 100 S(cm²) R (°C/W) th(j-a) DPAK 2 DPAK printed circuit board FR4, copper thickness: 35 µm |
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