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FIN1027M Fiches technique(PDF) 9 Page - Fairchild Semiconductor

No de pièce FIN1027M
Description  3.3V LVDS, 2-Bit, High-Speed, Differential Driver
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Fabricant  FAIRCHILD [Fairchild Semiconductor]
Site Internet  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

FIN1027M Fiches technique(HTML) 9 Page - Fairchild Semiconductor

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© 2001 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FIN1027 / FIN1027A • Rev. 1.0.3
9
Physical Dimensions
SEE DETAIL A
NOTES: UNLESS OTHERWISE SPECIFIED
A) THIS PACKAGE CONFORMS TO JEDEC
MS-012, VARIATION AA, ISSUE C,
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
FLASH OR BURRS.
D) LANDPATTERN STANDARD: SOIC127P600X175-8M.
E) DRAWING FILENAME: M08AREV13
LAND PATTERN RECOMMENDATION
SEATING PLANE
0.10 C
C
GAGE PLANE
x 45°
DETAIL A
SCALE: 2:1
PIN ONE
INDICATOR
4
8
1
C
M
BA
0.25
B
5
A
5.60
0.65
1.75
1.27
6.20
5.80
3.81
4.00
3.80
5.00
4.80
(0.33)
1.27
0.51
0.33
0.25
0.10
1.75 MAX
0.25
0.19
0.36
0.50
0.25
R0.10
R0.10
0.90
0.406
(1.04)
OPTION A - BEVEL EDGE
OPTION B - NO BEVEL EDGE
Figure 22. 8-Lead, Small Outline Package (SOIC), JEDEC MS-012, 0.150-inch, Narrow Body
Click here for tape and reel specifications, available at:
http://www.fairchildsemi.com/products/discrete/pdf/soic8_tr.pdf
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.


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