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74AHCT30D Fiches technique(PDF) 9 Page - NXP Semiconductors |
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74AHCT30D Fiches technique(HTML) 9 Page - NXP Semiconductors |
9 / 14 page 74AHC_AHCT30_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 26 June 2009 9 of 14 NXP Semiconductors 74AHC30; 74AHCT30 8-input NAND gate 12. Package outline Fig 8. Package outline SOT108-1 (SO14) UNIT A max. A1 A2 A3 bp cD(1) E(1) (1) eHE LLp QZ y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.0 0.4 SOT108-1 X w M θ A A1 A2 bp D HE L p Q detail X E Z e c L v M A (A ) 3 A 7 8 1 14 y 076E06 MS-012 pin 1 index 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.35 0.34 0.16 0.15 0.05 1.05 0.041 0.244 0.228 0.028 0.024 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 99-12-27 03-02-19 0 2.5 5 mm scale SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 |
Numéro de pièce similaire - 74AHCT30D |
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Description similaire - 74AHCT30D |
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