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LM3218 Fiches technique(PDF) 11 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
No de pièce LM3218
Description  650 mA Miniature, Adjustable, Step-Down DC-DC Converter for RF Power Amplifiers
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Fabricant  NSC [National Semiconductor (TI)]
Site Internet  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM3218 Fiches technique(HTML) 11 Page - National Semiconductor (TI)

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Block Diagram
30050404
FIGURE 2. Functional Block Diagram
Operation Description
The LM3218 is a simple, step-down DC-DC converter with a
2.6 µH series inductor substrate optimized for powering RF
power amplifiers (PAs) in mobile phones, portable communi-
cators, and similar battery powered RF devices. It is designed
to allow the RF PA to operate at maximum efficiency over a
wide range of power levels from a single Li-Ion battery cell. It
is based on current mode buck architecture, with syn-
chronous rectification for high efficiency. It is designed for a
maximum load capability of 650 mA when V
OUT > 1.05V (typ.)
and 400 mA when V
OUT < 1.00V (typ.) in PWM mode.
Maximum load range may vary from this depending on input
voltage, output voltage and the inductor chosen.
Efficiency is typically around 95% for a 400 mA load with 3.4V
output, 3.9V input. The LM3218 has an R
DSON management
scheme to increase efficiency when V
OUT 1V. The output
voltage is dynamically programmable from 0.8V to 3.6V by
adjusting the voltage on the control pin without the need for
external feedback resistors. This prolongs battery life by
changing the PA supply voltage dynamically depending on its
transmitting power.
Additional features include current overload protection and
thermal overload shutdown.
The LM3218 is constructed using a chip-scale 8-pin micro
SMD package and a LTCC inductor substrate. This package
offers the smallest possible integrated solution footprint for
space-critical applications such as cell phones, where board
area is an important design consideration. Use of a high
switching frequency (2 MHz) reduces the size of external
components. As shown in Figure 1, only two external capac-
itors are required for implementation. Use of this module
requires special design considerations for implementation.
(See LTCC Module Package Assembly and Use in the Appli-
cations Information section). The board mounting requires
careful board design and precision assembly equipment. Use
of this package is best suited for opaque-case applications,
where its edges are not subject to high-intensity ambient red
or infrared light. Also, the system controller should set EN low
during power-up and other low supply voltage conditions.
(See Shutdown Mode in the Device Information section.)
11
www.national.com


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