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CSD17507Q5A Fiches technique(PDF) 2 Page - Texas Instruments

No de pièce CSD17507Q5A
Description  30V, N-Channel NexFET??Power MOSFETs
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Fabricant  TI [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI - Texas Instruments

CSD17507Q5A Fiches technique(HTML) 2 Page - Texas Instruments

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CSD17507Q5A
SLPS243A – JULY 2010 – REVISED AUGUST 2010
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise stated)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Static Characteristics
BVDSS
Drain to Source Voltage
VGS = 0V, IDS = 250mA
30
V
IDSS
Drain to Source Leakage Current
VGS = 0V, VDS = 24V
1
mA
IGSS
Gate to Source Leakage Current
VDS = 0V, VGS = 20/-12V
100
nA
VGS(th)
Gate to Source Threshold Voltage
VDS = VGS, IDS = 250mA
1.1
1.6
2.1
V
VGS = 4.5V, IDS = 11A
11.8
16.1
m
RDS(on)
Drain to Source On Resistance
VGS = 10V, IDS = 11A
9
10.8
m
gfs
Transconductance
VDS = 15V, IDS = 11A
16
S
Dynamic Characteristics
Ciss
Input Capacitance
410
530
pF
VGS = 0V, VDS = 15V,
Coss
Output Capacitance
270
350
pF
f = 1MHz
Crss
Reverse Transfer Capacitance
23
30
pF
RG
Series Gate Resistance
0.7
1.4
Qg
Gate Charge Total (4.5V)
2.8
3.6
nC
Qgd
Gate Charge Gate to Drain
0.7
nC
VDS = 15V, IDS = 11A
Qgs
Gate Charge Gate to Source
1.3
nC
Qg(th)
Gate Charge at Vth
0.7
nC
Qoss
Output Charge
VDS = 13V, VGS = 0V
7.2
nC
td(on)
Turn On Delay Time
4.7
ns
tr
Rise Time
5.2
ns
VDS = 15V, VGS = 4.5V,
IDS = 11A,RG = 2Ω
td(off)
Turn Off Delay Time
5.7
ns
tf
Fall Time
2.3
ns
Diode Characteristics
VSD
Diode Forward Voltage
ISD = 11A, VGS = 0V
0.85
1
V
Qrr
Reverse Recovery Charge
11
nC
VDS= 13V, IF = 11A, di/dt = 300A/ms
trr
Reverse Recovery Time
16
ns
THERMAL CHARACTERISTICS
(TA = 25°C unless otherwise stated)
PARAMETER
MIN
TYP
MAX
UNIT
RqJC
Thermal Resistance Junction to Case(1)
1.9
°C/W
RqJA
Thermal Resistance Junction to Ambient(1)(2)
51
°C/W
(1)
RqJC is determined with the device mounted on a 1-inch
2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu pad on a 1.5-inch × 1.5-inch (3.81-cm ×
3.81-cm), 0.06-inch (1.52-mm) thick FR4 PCB. RqJC is specified by design, whereas RqJA is determined by the user’s board design.
(2)
Device mounted on FR4 material with 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu.
2
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