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AM26LV32EIDRG4 Fiches technique(PDF) 5 Page - Texas Instruments |
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AM26LV32EIDRG4 Fiches technique(HTML) 5 Page - Texas Instruments |
5 / 18 page SWITCHING CHARACTERISTICS ESD PROTECTION AM26LV32E www.ti.com............................................................................................................................................................... SLLS849A – APRIL 2008 – REVISED MAY 2008 over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT tPLH Propagation delay time, low- to high-level output 8 16 26 ns See Figure 1 tPHL Propagation delay time, high- to low-level output 8 16 26 ns tt Transition time See Figure 1 5 ns tPZH Output-enable time to high level See Figure 2 17 40 ns tPZL Output-enable time to low level See Figure 3 10 40 ns tPHZ Output-disable time from high level See Figure 2 20 40 ns tPLZ Output-disable time from low level See Figure 3 16 40 ns tsk(p) Pulse skew See Figure 1(2) 4 6 ns tsk(o) Pulse skew See Figure 1(3) 4 6 ns tsk(pp) Pulse skew (device to device) See Figure 1(4) 6 9 ns f(max) Maximum operating frequency See Figure 1 32 MHz (1) All typical values are at VCC = 3.3 V, TA = 25°C. (2) tsk(p) is |tpLH – tpHL| of each channel of same device. (3) tsk(o) is the maximum difference in propagation delay times between any two channels of same device switching in the same direction. (4) tsk(pp) is the maximum difference in propagation delay times between any two channels of any two devices switching in the same direction. PARAMETER TEST CONDITIONS TYP UNIT HBM ±15 Receiver input IEC61000-4-2, Air-Gap Discharge ±15 kV IEC61000-4-2, Contact Discharge ±8 Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Link(s): AM26LV32E |
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