TPS79516DCQ datasheet(11/23 Pages) TI

No de pièce	TPS79516DCQ

Description	ULTRALOW-NOISE, HIGH-PSRR, FAST, RF, 500-mA LOW-DROPOUT LINEAR REGULATORS

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Fabricant	TI [Texas Instruments]

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T

J

+ TA ) PD max

RθJA

(6)

RθJA +

T

J

* TA

P

D max

(7)

P

D max

+ (3.3 * 2.5) V

1A + 800mW

(8)

RθJA max + (125 * 55)°C 800mW + 87.5°C W

0

100

120

140

160

180

No Air Flow

80

60

40

20

0.1

1

10

PCB Copper Area (in2)

SOT223 POWER DISSIPATION

0

1

2

3

6

0

25

50

75

100

150

125

TA = 25°C

TA − Ambient Temperature (°C)

4

5

4 in2 PCB Area

0.5 in2 PCB Area

TPS795xx

SLVS350G – OCTOBER 2002 – REVISED JULY 2006

Equation 5 simplifies into Equation 6:

To illustrate, the TPS79525 in a SOT223 package

was chosen. For this example, the average input

voltage is 3.3 V, the output voltage is 2.5 V, the

Rearranging Equation 6 gives Equation 7:

average

output

current

is

1

A,

the

ambient

temperature 55

°C, no air flow is present, and the

operating environment is the same as documented

below.

Neglecting

the

quiescent

current,

the

maximum average power is Equation 8:

Using Equation 6 and the computer model generated

curves shown in Figure 26, a designer can quickly

compute

the

required

heatsink

thermal

Substituting TJmax for TJ into Equation 4 gives

resistance/board

area

for

a

given

ambient

Equation 9:

temperature,

power

dissipation,

and

operating

environment.

(9)

From Figure 26, RθJA vs PCB Copper Area, the

ground plane needs to be 0.55 in2 for the part to

dissipate 800 mW. The operating environment used

to construct Figure 26 consisted of a board with 1 oz.

copper planes. The package is soldered to a 1 oz.

copper pad on the top of the board. The pad is tied

through thermal vias to the 1 oz. ground plane.

From the data in Figure 26 and rearranging equation

6, the maximum power dissipation for a different

ground

plane

area

and

a

specific

ambient

temperature

can

be

computed,

as

shown

in

Figure 27.

Figure 26. SOT223 Thermal Resistance vs PCB

Copper Area

The SOT223 package provides an effective means

of managing power dissipation in surface-mount

applications. The SOT223 package dimensions are

provided in the Mechanical Data section at the end

of the data sheet. The addition of a copper plane

directly underneath the SOT223 package enhances

the thermal performance of the package.

Figure 27. SOT223 Maximum Power Dissipation

vs Ambient Temperature

11

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