Moteur de recherche de fiches techniques de composants électroniques
  French  ▼

Delete All
ON OFF
ALLDATASHEET.FR

X  

Preview PDF Download HTML

IP4337CX18 Fiches technique(PDF) 9 Page - NXP Semiconductors

No de pièce IP4337CX18
Description  7-channel integrated filter network with ESD input protection to IEC 61000-4-2 level 4
Download  12 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Fabricant  NXP [NXP Semiconductors]
Site Internet  http://www.nxp.com
Logo NXP - NXP Semiconductors

IP4337CX18 Fiches technique(HTML) 9 Page - NXP Semiconductors

Back Button IP4337CX18 Datasheet HTML 4Page - NXP Semiconductors IP4337CX18 Datasheet HTML 5Page - NXP Semiconductors IP4337CX18 Datasheet HTML 6Page - NXP Semiconductors IP4337CX18 Datasheet HTML 7Page - NXP Semiconductors IP4337CX18 Datasheet HTML 8Page - NXP Semiconductors IP4337CX18 Datasheet HTML 9Page - NXP Semiconductors IP4337CX18 Datasheet HTML 10Page - NXP Semiconductors IP4337CX18 Datasheet HTML 11Page - NXP Semiconductors IP4337CX18 Datasheet HTML 12Page - NXP Semiconductors  
Zoom Inzoom in Zoom Outzoom out
 9 / 12 page
background image
IP4337CX18LF_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 20 August 2009
9 of 12
NXP Semiconductors
IP4337CX18/LF
7-channel integrated filter network with ESD input protection
For further information on temperature profiles, refer to application note
AN10365
“Surface mount reflow soldering description”.
9.3.1 Stand off
The stand off between the substrate and the chip is determined by:
The amount of printed solder on the substrate
The size of the solder land on the substrate
The bump height on the chip
The higher the stand off, the better the stresses are released due to TEC (Thermal
Expansion Coefficient) differences between substrate and chip.
9.3.2 Quality of solder joint
A flip-chip joint is considered to be a good joint when the entire solder land has been
wetted by the solder from the bump. The surface of the joint should be smooth and the
shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps
after reflow can occur during the reflow process in bumps with high ratio of bump diameter
to bump height, i.e. low bumps with large diameter. No failures have been found to be
related to these voids. Solder joint inspection after reflow can be done with X-ray to
monitor defects such as bridging, open circuits and voids.
9.3.3 Rework
In general, rework is not recommended. By rework we mean the process of removing the
chip from the substrate and replacing it with a new chip. If a chip is removed from the
substrate, most solder balls of the chip will be damaged. In that case it is recommended
not to re-use the chip again.
MSL: Moisture Sensitivity Level
Fig 8.
Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature


Html Pages

1  2  3  4  5  6  7  8  9  10  11  12 


Fiches technique Télécharger

Go To PDF Page


Lien URL




Politique de confidentialité
ALLDATASHEET.FR
ALLDATASHEET vous a-t-il été utile ?  [ DONATE ] 

À propos de Alldatasheet   |   Publicité   |   Contactez-nous   |   Politique de confidentialité   |   Echange de liens   |   Fabricants
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn