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BF622 Fiches technique(PDF) 5 Page - NXP Semiconductors |
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BF622 Fiches technique(HTML) 5 Page - NXP Semiconductors |
5 / 10 page 2004 Dec 14 5 NXP Semiconductors Product data sheet NPN high-voltage transistors BF620; BF622 THERMAL CHARACTERISTICS Notes 1. Device mounted on a printed-circuit board, single-sided copper, tin-plated and standard footprint. 2. Device mounted on a printed-circuit board, single-sided copper, tin-plated and mounting pad for collector 1 cm2. 3. Device mounted on a printed-circuit board, single-sided copper, tin-plated and mounting pad for collector 6 cm2. SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth(j-a) thermal resistance from junction to ambient in free air note 1 250 K/W note 2 156 K/W note 3 113 K/W Rth(j-s) thermal resistance from junction to soldering point 30 K/W 006aaa235 10−5 10 10−2 10−4 102 10−1 tp (s) 10−3 103 1 102 10 103 Zth (K/W) 1 (6) (7) (8) (9) (10) (1) (5) (4) (3) (2) Fig.3 Transient thermal impedance as a function of pulse time; typical values. (1) δ = 1. (2) δ = 0.75. (3) δ = 0.5. (4) δ = 0.33. (5) δ = 0.2. (6) δ = 0.1. (7) δ = 0.05. (8) δ = 0.02. (9) δ = 0.01. (10) δ = 0. Mounted on FR4 printed-circuit board; standard footprint. |
Numéro de pièce similaire - BF622 |
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Description similaire - BF622 |
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