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74LVTH16244BBQ Fiches technique(PDF) 1 Page - NXP Semiconductors

No de pièce 74LVTH16244BBQ
Description  3.3 V 16-bit buffer/driver; 3-state
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Fabricant  NXP [NXP Semiconductors]
Site Internet  http://www.nxp.com
Logo NXP - NXP Semiconductors

74LVTH16244BBQ Fiches technique(HTML) 1 Page - NXP Semiconductors

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1.
General description
The 74LVT16244B; 74LVTH16244B is a high-performance BiCMOS product designed for
VCC operation at 3.3 V.
This device is a 16-bit buffer and line driver featuring non-inverting 3-state bus outputs.
The device can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer.
2.
Features and benefits
16-bit bus interface
3-state buffers
Output capability: +64 mA and
−32 mA
TTL input and output switching levels
Input and output interface capability to systems at 5 V supply
Bus hold data inputs eliminate need for external pull-up resistors to hold unused inputs
Power-up 3-state
Live insertion and extraction permitted
No bus current loading when output is tied to 5 V bus
Latch-up protection
JESD78B Class II exceeds 500 mA
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
3.
Ordering information
74LVT16244B; 74LVTH16244B
3.3 V 16-bit buffer/driver; 3-state
Rev. 08 — 22 March 2010
Product data sheet
Table 1.
Ordering information
Type number
Package
Temperature range
Name
Description
Version
74LVT16244BDL
−40 °C to +85 °C
SSOP48
plastic shrink small outline package; 48 leads;
body width 7.5 mm
SOT370-1
74LVTH16244BDL
74LVT16244BDGG
−40 °C to +85 °C
TSSOP48
plastic thin shrink small outline package;
48 leads; body width 6.1 mm
SOT362-1
74LVTH16244BDGG
74LVT16244BEV
−40 °C to +85 °C
VFBGA56
plastic very thin fine-pitch ball grid array
package; 56 balls; body 4.5
× 7 × 0.65 mm
SOT702-1
74LVT16244BBQ
−40 °C to +85 °C
HXQFN60U plastic thermal enhanced extremely thin quad
flat package; no leads; 60 terminals; UTLP
based; body 4
× 6 × 0.5 mm
SOT1134-1
74LVTH16244BBQ


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