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74HC257DB Fiches technique(PDF) 11 Page - NXP Semiconductors |
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74HC257DB Fiches technique(HTML) 11 Page - NXP Semiconductors |
11 / 17 page 74HC_HCT257_5 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 05 — 13 January 2010 11 of 17 NXP Semiconductors 74HC257; 74HCT257 Quad 2-input multiplexer; 3-state 12. Package outline Fig 9. Package outline SOT38-4 (DIP16) REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT38-4 95-01-14 03-02-13 MH c (e ) 1 ME A L A1 w M b1 b2 e D A2 Z 16 1 9 8 E pin 1 index b 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. UNIT A max. 12 b1 (1) (1) (1) b2 cD E e M Z H L mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) A min. A max. b max. w M E e 1 1.73 1.30 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 0.76 4.2 0.51 3.2 inches 0.068 0.051 0.021 0.015 0.014 0.009 1.25 0.85 0.049 0.033 0.77 0.73 0.26 0.24 0.14 0.12 0.01 0.1 0.3 0.32 0.31 0.39 0.33 0.03 0.17 0.02 0.13 DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4 |
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