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74AUP3G04GD Fiches technique(PDF) 11 Page - NXP Semiconductors |
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74AUP3G04GD Fiches technique(HTML) 11 Page - NXP Semiconductors |
11 / 17 page 74AUP3G04_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 8 October 2009 11 of 17 NXP Semiconductors 74AUP3G04 Low-power triple inverter 13. Package outline Fig 10. Package outline SOT765-1 (VSSOP8) UNIT A1 A max. A2 A3 bp L HE Lp wy v ce D(1) E(2) Z(1) θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.00 0.85 0.60 0.27 0.17 0.23 0.08 2.1 1.9 2.4 2.2 0.5 3.2 3.0 0.4 0.1 8 ° 0 ° 0.13 0.1 0.2 0.4 DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.40 0.15 Q 0.21 0.19 SOT765-1 MO-187 02-06-07 w M bp D Z e 0.12 14 8 5 θ A2 A1 Q Lp (A3) detail X A L HE E c v M A X A y 2.5 5 mm 0 scale VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm SOT765-1 1 pin 1 index |
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