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ADV3219ACPZ-RL Fiches technique(PDF) 5 Page - Analog Devices

No de pièce ADV3219ACPZ-RL
Description  800 MHz, 2:1 Analog Multiplexers
Download  20 Pages
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Fabricant  AD [Analog Devices]
Site Internet  http://www.analog.com
Logo AD - Analog Devices

ADV3219ACPZ-RL Fiches technique(HTML) 5 Page - Analog Devices

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ADV3219/ADV3220
Rev. 0 | Page 5 of 20
ABSOLUTE MAXIMUM RATINGS
POWER DISSIPATION
Table 3.
Parameter
Rating
Supply Voltage (V+ − V−)
12 V
Analog Input Voltage
V− to V+
Digital Input Voltage
0 to V+
Output Voltage (Disabled Output)
(V+ − 1 V) to (V− + 1 V)
Output Short-Circuit
Duration
Momentary
Current
50 mA
Temperature
Storage Temperature Range
−65°C to +150°C
Operating Temperature Range
−40°C to +85°C
Junction Temperature
150°C
The ADV3219/ADV3220 are operated with ±5 V supplies and
can drive loads down to 150 Ω, resulting in a wide range of
possible power dissipations. For this reason, extra care must
be taken derating the operating conditions based on ambient
temperature.
Packaged in an 8-lead LFCSP, the ADV3219 and ADV3220
junction-to-ambient thermal impedance (θJA) is 85°C/W. For long-
term reliability, the maximum allowed junction temperature of the
die, TJ, should not exceed 125°C. Temporarily exceeding this
limit can cause a shift in parametric performance due to a change
in stresses exerted on the die by the package. Figure 2 shows the
range of the allowed internal die power dissipations that meet
these conditions over the −40°C to +85°C ambient temperature
range. When using Figure 2, do not include the external load
power in the maximum power calculation, but do include the
load current through the die output transistors.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
1.5
0.3
0.6
0.9
1.2
15
25
35
45
55
65
75
85
AMBIENT TEMPERATURE (°C)
TJ = 125°C
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
θJA
θJC
Unit
8-Lead LFCSP
85
23
°C/W
Figure 2. Maximum Die Power Dissipation vs. Ambient Temperature
ESD CAUTION


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