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TPS61325YFFT Fiches technique(PDF) 2 Page - Texas Instruments

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No de pièce TPS61325YFFT
Description  1.5A/4.1A Multiple LED Camera Flash Driver With I2CTM Compatible Interface
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Fabricant  TI [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI - Texas Instruments

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TPS61325
SLVS977 – FEBRUARY 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
AVAILABLE OPTIONS
PART NUMBER(1)
PACKAGE MARKING
PACKAGE
DEVICE SPECIFIC FEATURES(2)
Dual Wire Camera Module Interface (STRB0, STRB1)
TPS61325YFF
61325
CSP-20
LED Temperature Monitoring Input (TS)
(1)
The YFF package is available in tape and reel. Add R suffix (TPS6132xYFFR) to order quantities of 3000 parts per reel, T suffix for 250
parts per reel.
(2)
For more details, refer to the section Application Diagrams.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE
UNIT
Voltage range on AVIN, VOUT, SW, LED1, LED2, LED3(2)
–0.3 to 7
V
VI
Voltage range on SCL, SDA, STRB0, STRB1, GPIO/PG(2)
–0.3 to 7
V
Voltage range on HC_SEL, Tx-MASK, TS, BAL (2)
–0.3 to 7
V
Current on GPIO/PG
±25
mA
Power dissipation
Internally limited
TA
(3)
Operating ambient temperature range
–40 to 85
°C
TJ (MAX)
Maximum operating junction temperature
150
°C
Tstg
Storage temperature range
–65 to 150
°C
Human body model
2
kV
ESD rating (4)
Charge device model
500
V
Machine model
100
V
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to network ground terminal.
(3)
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature [TA(max)] is dependent on the maximum operating junction temperature [TJ(max)], the
maximum power dissipation of the device in the application [PD(max)], and the junction-to-ambient thermal resistance of the part/package
in the application (qJA), as given by the following equation: TA(max) = TJ(max) – (qJA × PD(max))
(4)
The human body model is a 100-pF capacitor discharged through a 1.5-k
Ω resistor into each pin. The machine model is a 200-pF
capacitor discharged directly into each pin.
DISSIPATION RATINGS
PACKAGE
THERMAL RESISTANCE(1)
THERMAL RESISTANCE(1)
POWER RATING
DERATING FACTOR
qJA
qJB
TA = 25°C
ABOVE(2) TA = 25°C
YFF
71°C/W
21°C/W
1.4 W
14mW/°C
(1)
Simulated with high-K board
(2)
Maximum power dissipation is a function of TJ(max), qJA and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/ qJA.
2
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Copyright © 2010, Texas Instruments Incorporated


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