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TPS61325YFFT Fiches technique(PDF) 2 Page - Texas Instruments |
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TPS61325YFFT Fiches technique(HTML) 2 Page - Texas Instruments |
2 / 62 page TPS61325 SLVS977 – FEBRUARY 2010 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. AVAILABLE OPTIONS PART NUMBER(1) PACKAGE MARKING PACKAGE DEVICE SPECIFIC FEATURES(2) Dual Wire Camera Module Interface (STRB0, STRB1) TPS61325YFF 61325 CSP-20 LED Temperature Monitoring Input (TS) (1) The YFF package is available in tape and reel. Add R suffix (TPS6132xYFFR) to order quantities of 3000 parts per reel, T suffix for 250 parts per reel. (2) For more details, refer to the section Application Diagrams. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) VALUE UNIT Voltage range on AVIN, VOUT, SW, LED1, LED2, LED3(2) –0.3 to 7 V VI Voltage range on SCL, SDA, STRB0, STRB1, GPIO/PG(2) –0.3 to 7 V Voltage range on HC_SEL, Tx-MASK, TS, BAL (2) –0.3 to 7 V Current on GPIO/PG ±25 mA Power dissipation Internally limited TA (3) Operating ambient temperature range –40 to 85 °C TJ (MAX) Maximum operating junction temperature 150 °C Tstg Storage temperature range –65 to 150 °C Human body model 2 kV ESD rating (4) Charge device model 500 V Machine model 100 V (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal. (3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature [TA(max)] is dependent on the maximum operating junction temperature [TJ(max)], the maximum power dissipation of the device in the application [PD(max)], and the junction-to-ambient thermal resistance of the part/package in the application (qJA), as given by the following equation: TA(max) = TJ(max) – (qJA × PD(max)) (4) The human body model is a 100-pF capacitor discharged through a 1.5-k Ω resistor into each pin. The machine model is a 200-pF capacitor discharged directly into each pin. DISSIPATION RATINGS PACKAGE THERMAL RESISTANCE(1) THERMAL RESISTANCE(1) POWER RATING DERATING FACTOR qJA qJB TA = 25°C ABOVE(2) TA = 25°C YFF 71°C/W 21°C/W 1.4 W 14mW/°C (1) Simulated with high-K board (2) Maximum power dissipation is a function of TJ(max), qJA and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/ qJA. 2 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated |
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