STK416-090-E

No. A1621-3/12

Continued from preceding page.

*8: Thermal design must be implemented based on the conditions under which the customer’s end products are

expected to operate on the market.

*9: The thermoplastic adhesive is used to bond the case and the aluminum substrate, so, please be sure to fix the Hybrid

IC on the heat sink before soldering and mount it. In addition, please attach and remove the heat sink at normal

temperature.

*10: Weight of HIC: 36.8g

Outer carton dimensions (W

×L×H): 452mm×325mm×192mm

Package Dimensions

unit:mm (typ)

Designated transformer power supply

(MG-250 equivalent)

10000

μF

10000

μF

DBA40C

500

Ω

500

Ω

+VH

-VH

+

+

10000

μF

10000

μF

DBA40C

500

Ω

500

Ω

+VL

-VL

+

+

Designated transformer power supply

(MG-200 equivalent)

9.0

70.0

78.0

2.9

5.5

0.4

3.6

22 2.0=44.0

2.0

(13.0)

0.5

123

(R1.8)