TPS92010

SLUSA14 – DECEMBER 2009

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted

(1)

TPS92010

UNIT

VDD

Supply voltage range

27

V

Supply current

20

mA

Output sink current (peak)

1.2

A

Output source current (peak)

–0.8

Analog inputs

FB, PCS, SS

–0.3 to 6.0

V

–1.0 to 6.0

–1.0

mA

VDD = 0 V to 30 V

30

V

Power dissipation

650

mW

Operating junction temperature range

–55 to 150

Storage temperature

–65 to 150

°C

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

300

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages

are with respect to GND. Currents are positive into, negative out of the specified terminal.

RECOMMENDED OPERATING CONDITIONS

MIN

MAX

UNIT

VDD

Input voltage

21

V

Output sink current

0

A

Operating junction temperature

–40

105

°C

ELECTROSTATIC DISCHARGE (ESD) PROTECTION

MIN

MAX

UNIT

Human body model

2000

V

CDM

1500

2

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