LSBK3333 datasheet(6/6 Pages) LIGITEK

No de pièce	LSBK3333

Description	ROUND TYPE LED LAMPS

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Fabricant	LIGITEK [LIGITEK electronics co., ltd.]

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Description

Test Condition

Test Item

The purpose of this is the resistance

of the device which is laid under

condition of low temperature for hours.

The purpose of this is the resistance of

the device which is laid under condition

of high temperature for hours.

1.Ta=105

℃±5℃

2.t=1000 hrs (-24hrs, +72hrs)

Operating Life Test

High Temperature

Storage Test

1.Ta=-40

℃±5℃

2.t=1000 hrs (-24hrs, +72hrs)

Low Temperature

Storage Test

This test is conducted for the purpose

of detemining the resistance of a part

in electrical and themal stressed.

1.Under Room Temperature

2.If=20mA

3.t=1000 hrs (-24hrs, +72hrs)

MIL-STD-883:1008

JIS C 7021: B-10

JIS C 7021: B-12

MIL-STD-750: 1026

MIL-STD-883: 1005

JIS C 7021: B-1

Reference

Standard

Page 5/5

Reliability Test:

The purpose of this test is the resistance

of the device under tropical for hours.

The purpose of this is the resistance of

the device to sudden extreme changes

in high and low temperature.

1.Ta=65

℃±5℃

2.RH=90 %~95%

3.t=240hrs

±2hrs

High Temperature

High Humidity Test

Thermal Shock Test

Solder Resistance

Test

1.Ta=105

℃±5℃&-40℃±5℃

(10min) (10min)

2.total 10 cycles

This test intended to see soldering well

performed or not.

1.T.Sol=230

℃±5℃

2.Dwell time=5

±1sec

Solderability Test

This test intended to determine the

thermal characteristic resistance

of the device to sudden exposures

at extreme changes in temperature

when soldering the lead wire.

1.T.Sol=260

℃±5℃

2.Dwell time= 10

±1sec.

MIL-STD-202: 107D

MIL-STD-750: 1051

MIL-STD-883: 1011

MIL-STD-202: 210A

MIL-STD-750: 2031

JIS C 7021: A-1

MIL-STD-202: 208D

MIL-STD-750: 2026

MIL-STD-883: 2003

JIS C 7021: A-2

MIL-STD-202:103B

JIS C 7021: B-11

LSBK3333

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