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LFD415-62-XX-RP33-PF Fiches technique(PDF) 9 Page - LIGITEK electronics co., ltd. |
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LFD415-62-XX-RP33-PF Fiches technique(HTML) 9 Page - LIGITEK electronics co., ltd. |
9 / 9 page MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. Solderability Test MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Solder Resistance Test Thermal Shock Test Low Temperature Storage Test High Temperature Storage Test High Temperature High Humidity Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) Test Condition Reliability Test: Operating Life Test Test Item This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Description Reference Standard Page 8/8 LFD415/62-XX/RP33-PF PART NO. |
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Description similaire - LFD415-62-XX-RP33-PF |
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