LA289B-SRG-AS-PF datasheet(7/7 Pages) LIGITEK

No de pièce	LA289B-SRG-AS-PF

Description	LED ARRAY

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Fabricant	LIGITEK [LIGITEK electronics co., ltd.]

Site Internet	http://www.ligitek.com

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This test is conducted for the purpose

of detemining the resistance of a part

in electrical and themal stressed.

MIL-STD-750: 1026

MIL-STD-883: 1005

JIS C 7021: B-1

The purpose of this is the resistance of

the device which is laid under condition

of high temperature for hours.

MIL-STD-883:1008

JIS C 7021: B-10

Description

Reference

Standard

LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

Reliability Test:

1.Under Room Temperature

2.If=20mA

3.t=1000 hrs (-24hrs, +72hrs)

Operating Life Test

1.Ta=105

℃±5℃

2.t=1000 hrs (-24hrs, +72hrs)

High Temperature

Storage Test

Test Item

Test Condition

The purpose of this test is the resistance

of the device under tropical for hours.

MIL-STD-202:103B

JIS C 7021: B-11

The purpose of this is the resistance of

the device to sudden extreme changes

in high and low temperature.

MIL-STD-202: 107D

MIL-STD-750: 1051

MIL-STD-883: 1011

This test intended to see soldering well

performed or not.

MIL-STD-202: 208D

MIL-STD-750: 2026

MIL-STD-883: 2003

JIS C 7021: A-2

This test intended to determine the

thermal characteristic resistance

of the device to sudden exposures

at extreme changes in temperature

when soldering the lead wire.

MIL-STD-202: 210A

MIL-STD-750: 2031

JIS C 7021: A-1

1.Ta=65

℃±5℃

2.RH=90 %~95%

3.t=240hrs

±2hrs

High Temperature

High Humidity Test

1.Ta=105

℃±5℃&-40℃±5℃

(10min) (10min)

2.total 10 cycles

Thermal Shock Test

1.T.Sol=230

℃±5℃

2.Dwell time=5

±1sec

Solderability Test

1.T.Sol=260

℃±5℃

2.Dwell time= 10

±1sec.

Solder Resistance

Test

The purpose of this is the resistance

of the device which is laid under

condition of low temperature for hours.

1.Ta=-40

℃±5℃

2.t=1000 hrs (-24hrs, +72hrs)

Low Temperature

Storage Test

JIS C 7021: B-12

PART NO. LA289B/SRG-AS-PF

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