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LA92B-2YG-PF Fiches technique(PDF) 7 Page - LIGITEK electronics co., ltd. |
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LA92B-2YG-PF Fiches technique(HTML) 7 Page - LIGITEK electronics co., ltd. |
7 / 7 page Reference Standard 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs High Temperature High Humidity Test Solder Resistance Test Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec Thermal Shock Test Low Temperature Storage Test High Temperature Storage Test Operating Life Test MIL-STD-202:103B JIS C 7021: B-11 The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Test Condition Reliability Test: Test Item Description LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/6 PART NO. LA92B/2YG-PF |
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