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LA29B-1-2HY3G-S1-PF Fiches technique(PDF) 8 Page - LIGITEK electronics co., ltd. |
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LA29B-1-2HY3G-S1-PF Fiches technique(HTML) 8 Page - LIGITEK electronics co., ltd. |
8 / 8 page Page 7/7 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reference Standard Description MIL-STD-883:1008 JIS C 7021: B-10 This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Test Condition Test Item 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Operating Life Test High Temperature Storage Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Reliability Test: The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-202:103B JIS C 7021: B-11 This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles Thermal Shock Test 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs High Temperature High Humidity Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Solder Resistance Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec Solderability Test The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. LA29B-1/2HY3G-S1-PF PART NO. |
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