Moteur de recherche de fiches techniques de composants électroniques
Selected language     French  ▼

Delete All
ON OFF
ALLDATASHEET.FR

X  

Preview PDF Download HTML

SI-3033ZD Datasheet(Fiches technique) 2 Page - Allegro MicroSystems

Numéro de pièce SI-3033ZD
Description  Surface-Mount, Low Dropout Voltage Linear Regulator ICs
Télécharger  2 Pages
Scroll/Zoom Zoom In 100% Zoom Out
Fabricant  ALLEGRO [Allegro MicroSystems]
Site Internet  http://www.allegromicro.com
Logo ALLEGRO - Allegro MicroSystems

SI-3033ZD Datasheet(HTML) 2 Page - Allegro MicroSystems

  SI-3033ZD Datenblatt HTML 1Page - Allegro MicroSystems SI-3033ZD Datasheet HTML 2Page - Allegro MicroSystems  
Zoom Inzoom in Zoom Outzoom out
 2 / 2 page
background image
27
ICs
SI-3000ZD Series
■External Dimensions (TO263-5)
(Unit : mm)
Pin Assignment
q VC
w VIN
e GND (Common to the rear side of product)
r VO
t Sense
(ADJ for SI-3011ZD)
Plastic Mold Package Type
Flammability: UL94V-0
Product Mass: Approx. 1.48g
9.9
±0.2
(15
°)
(0.5)
2-R0.3
0.1
10.0
±0.02
3-R0.3
(2
×R0.45)
(R0.3)
(R0.3)
0.88
±0.10
1.5 Dp:
±0.2
φ
(1.7
±0.25
)
12345
(1.7
±0.25
)
(1.7
±0.25
)
(1.7
±0.25
)
0.8
±0.1
0.8
±0.1
4.5
±0.2
1.3
0.10
±0.15
2.4
±0.2
+0.10
–0.05
10.0
±0.2
(4.4)
(8.0)
(3
°)
(3
°)
(3
°)
(3
°)
(3
°)
0~6
°
Case temperature
measurement point
■Block Diagram
CIN: Input capacitor (Approx. 10
µF)
CO: Output capacitor (47
µF or larger)
The output voltage may oscillate if a low ESR type capacitor
(such as a ceramic capacitor) is used for the output capacitor in
the SI-3000ZD Series.
R1, R2: Output voltage setting resistors
The output voltage can be set by connecting R1 and R2 as shown
at left.
The recommended value for R2 is 10k
Ω or 11kΩ.
R1= (VO–VADJ) / (VADJ/R2)
*: Insert R3 in case of setting VO to VO
≤ 1.8V. The recommended
value for R3 is 10k
Ω.
SI-3011ZD
SI-3033ZD
REF
TSD
Drive
VIN
CIN
VC
ON/
OFF
VO
CO
R1
R2
ADJ
GND
4
-
+
-
+
+
*
R3
2
5
3
1
OCP
AMP1
REF
TSD
Drive
VIN
CIN
ON/
OFF
VO
SENSE
CO
GND
4
-
+
-
+
+
2
5
3
1
OCP
AMP1
VC
■Reference Data
Copper Laminate Area (on Glass-Epoxy Board) vs.
Thermal Resistance (from Junction to Ambient Temperature) (Typical Value)
55
50
45
40
35
30
0
200
400
600
800
1000
Copper Laminate Area (mm2)
1200
1400
1600
1800
When Using Glass-Epoxy Board of 40
× 40 mm
•A higher heat radiation effect can be achieved by enlarging the copper laminate
area connected to the inner frame to which a monolithic IC is mounted.
•Obtaining the junction temperature
Measure GND terminal temperature TC with a thermocouple, etc. Then substitute
this value in the following formula to obtain the junction temperature.
Tj=P
θj–C+TC
PD= (VIN–VO)•IOUT


Html Pages

1  2 


Datasheet Download

Go To PDF Page


Lien URL



Privacy Policy
ALLDATASHEET.FR
AllDATASHEET vous a-t-il été utile ?   [ DONATE ]  

À propos de Alldatasheet   |   Publicit   |   Contactez-nous   |   Politique de confidentialit   |   Echange de liens   |   Manufacturer List
All Rights Reserved© Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn