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74LVTN16244BDGG Fiches technique(PDF) 11 Page - NXP Semiconductors |
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74LVTN16244BDGG Fiches technique(HTML) 11 Page - NXP Semiconductors |
11 / 15 page 74LVTN16244B_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 13 July 2009 11 of 15 NXP Semiconductors 74LVTN16244B 3.3 V 16-bit buffer/driver; 3-state 12. Package outline Fig 8. Package outline SOT362-1 (TSSOP48) UNIT A1 A2 A3 bp cD(1) E(2) eHE LLp QZ y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.2 0.1 8 0 o o 0.1 DIMENSIONS (mm are the original dimensions). Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. SOT362-1 99-12-27 03-02-19 w M θ A A1 A2 D L p Q detail X E Z e c L X (A ) 3 0.25 124 48 25 y pin 1 index b H 1.05 0.85 0.28 0.17 0.2 0.1 12.6 12.4 6.2 6.0 0.5 1 0.25 8.3 7.9 0.50 0.35 0.8 0.4 0.08 0.8 0.4 p E v M A A TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm SOT362-1 A max. 1.2 0 2.5 5 mm scale MO-153 |
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