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TPS76825QDR Fiches technique(PDF) 5 Page - Texas Instruments |
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TPS76825QDR Fiches technique(HTML) 5 Page - Texas Instruments |
5 / 22 page www.ti.com ABSOLUTE MAXIMUM RATINGS DISSIPATION RATING TABLE 1 - FREE-AIR TEMPERATURES DISSIPATION RATING TABLE 2 - FREE-AIR TEMPERATURES RECOMMENDED OPERATING CONDITIONS TPS76815Q, TPS76818Q, TPS76825Q TPS76827Q, TPS76828Q, TPS76830Q TPS76833Q, TPS76850Q, TPS76801Q SLVS211J – JUNE 1999 – REVISED OCTOBER 2004 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates over operating free-air temperature range (unless otherwise noted) (1) Input voltage range, VI(2) -0.3 V to 13.5 V Voltage range at EN -0.3 V to VI + 0.3 V Maximum PG voltage 16.5 V Peak output current Internally limited Continuous total power dissipation See dissipation rating tables Output voltage, VO (OUT, FB) 7 V Operating junction temperature range, TJ -40 °C to 125°C Storage temperature range, Tstg -65 °C to 150°C ESD rating, HBM 2 kV (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network terminal ground. TA < 25°C POWER DERATING FACTOR TA = 70°C POWER TA = 85°C POWER PACKAGE AIR FLOW (CFM) RATING ABOVE TA = 25°C RATING RATING 0 568.18 mW 5.6818 mW/ °C 312.5 mW 227.27 mW D 250 904.15 mW 9.0415 mW/ °C 497.28 mW 361.66 mW TA < 25°C POWER DERATING FACTOR TA = 70°C POWER TA = 85°C POWER PACKAGE AIR FLOW (CFM) RATING ABOVE TA = 25°C RATING RATING 0 2.9 W 23.5 mW/ °C 1.9 W 1.5 W PWP(1) 300 4.3 W 34.6 mW/ °C 2.8 W 2.2 W 0 3 W 23.8 mW/ °C 1.9 W 1.5 W PWP(2) 300 7.2 W 57.9 mW/ °C 4.6 W 3.8 W (1) This parameter is measured with the recommended copper heat sink pattern on a 1-layer PCB, 5-in x 5-in PCB, 1 oz. copper, 2-in x 2-in coverage (4 in2). (2) This parameter is measured with the recommended copper heat sink pattern on an 8-layer PCB, 1.5-in x 2-in PCB, 1 oz. copper, with layers 1, 2, 3, 4, 5, 7, and 8 at 5% coverage (0.9 in2) and layers 3 and 6 at 100% coverage (6 in2). For more information, refer to TI technical brief SLMA002, available for download at www.ti.com. MIN MAX UNIT Input voltage, VI(1) 2.7 10 V Output voltage range, VO 1.2 5.5 V Output current, IO(2) 0 1.0 A Operating junction temperature, TJ(2) 40 125 °C (1) To calculate the minimum input voltage for your maximum output current, use the following equation: VI(min)= VO(max) + VDO(max load). (2) Continuous current and operating junction temperature are limited by internal protection circuitry, but it is not recommended that the device operate under conditions beyond those specified in this table for extended periods of time. 5 |
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Description similaire - TPS76825QDR |
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