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TLC25L2 Fiches technique(PDF) 3 Page - Texas Instruments |
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TLC25L2 Fiches technique(HTML) 3 Page - Texas Instruments |
3 / 21 page TLC252, TLC252A, TLC252B, TLC252Y, TLC25L2, TLC25L2A, TLC25L2B TLC25L2Y, TLC25M2, TLC25M2A, TLC25M2B, TLC25M2Y LinCMOS ™ DUAL OPERATIONAL AMPLIFIERS SLOS002G – JUNE 1983 – REVISED AUGUST 1996 3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLC252Y, TLC25L2Y, and TLC25M2Y chip information These chips, properly assembled, display characteristics similar to the TLC252 / 25_2. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 × 4 MINIMUM TJMAX = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. PIN (4) IS INTERNALLY CONNECTED TO BACKSIDE OF CHIP. + – 1OUT 1IN + 1IN – VDD VDD – /GND (8) (6) (3) (2) (5) (1) – + (7) 2IN + 2IN – 2OUT (4) 60 73 (2) (1) (8) (7) (6) (5) (3) (4) |
Numéro de pièce similaire - TLC25L2 |
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Description similaire - TLC25L2 |
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